Name
Flexible / Printed Electronics in Next Generation HMI Devices
Date & Time
Wednesday, June 6, 2018, 9:00 AM - 9:20 AM
Bobby Bedi
Description
Printed Electronic Circuits has many names – In Mold Electronics, Molded Interconnect Devices, Circuits in Plastic, Flexible Electronics to name a few. It represents an emerging field that has been researched for the last 15+ years – primarily in Europe.
 
In this presentation discussions will take place on new HMI technologies that are ready for manufacturability including engineering support as well as identifying innovations in electronics, lighting, raw materials and production and develop application design concepts, with an end goal to improve reliability and product styling to enhance owner experiences and reduce production complexity.
Location Name
Stanford
Full Address
The Westin Chicago Northwest
400 Park Boulevard
Itasca, IL 60143
United States
Session Type
Industrial Breakout Session